ACF Tacking Machine
The machine is capable of performing ACF Bonding, HSC Bonding and Hot Bar Soldering applications.
Easy operation, high precision alignment. At the same time, it can be used for bonding FOG, TAB onto LCD and PCB.
Key Feature:
1. Work stage is design for positive and negative bonding, can be used for bonding both sides of ITO.
2. Bond head is made from imported special materials with high heat stability.
3. X , Y and Q directions of TAB work platform are adjustable.
4. Bonding temperature, time and pressure are adjustable, while product bonding times can be counted.